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UV Dicing Tape


UV Dicing Tape

This tape is formed by applying a UV release adhesive to a highly isotropic polyolefin substrate. The tape can be fixed to protect the integrated circuit board during the cutting process, the chip can be easily peeled off from the tape after being irradiated by UV ultraviolet light; the tape can be used for slitting of various packages such as BGA and QFN.


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