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Lead-Frame Support Film


Lead-Frame Support Film

This product is mainly used for the support and protection of the lead frame in integrated circuits due to its superior high temperature resistance and dimensional stability; 1) can withstand 240 ° C high temperature for 24H without deformed and no wrinkles; 2) Plasma treatment without deformation; 3) Hollow lead frame without overflow; 4) No residual offset after peeling from the lead frame; 5) Tape is easy to peel off;


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