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Integrated Circuit Packing Materials

Integrated Circuit Packing Materials


Based on independent research and development, we use advanced equipment and technology to produce many kinds of functional laminates with high performance and quality. The products have the characteristics such as shielding, insulation, fusible and flame retardant by variety of packaging methods, it is widely used in the fields such as wire and cable, semiconductor packaging etc.


Key words

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High Temperature ResistanceNo DistortionNo Residue



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Easy PeelingUV VisbreakingFixed Protection